Samsung Electronics plans to utilize chip making technology pioneered by SK Hynix to enhance its production of high-end chips for artificial intelligence (AI). The move aims to address Samsung’s absence in supplying latest HBM chips to AI chip leader Nvidia, unlike its competitors SK Hynix and Micron Technology. Samsung’s decision to shift towards the mass reflow molded underfill (MR-MUF) method marks a departure from its previous non-conductive film (NCF) technology, which faced production challenges. Despite facing lower production yields compared to SK Hynix, Samsung aims to boost its HBM3 chip production.